The 2UUL DW11 SolderAway Desoldering Wick gives you a fluorine-free braided copper wire built for fast, low-residue tin removal on mobile phone PCBs. Each box packs 10 rolls at 2.0mm width and 1.5m length, so your repair bench stays stocked for BGA rework, IC removal, and general motherboard cleaning jobs. The soft-woven copper strands lift excess solder quickly while resisting oxidation, keeping pads clean for re-soldering. You get consistent absorption without leaving behind sticky flux residue, which means less board cleaning afterward and faster turnaround on every job. Built for technicians who handle dead phone boards, IC change work, and jumper repairs daily, this wick pairs well with any soldering iron used on modern smartphone motherboards.
