This nozzle gives you a dedicated shortcut for iPhone X motherboard rework. Built for the QUICK 861DW and Quick 2008 hot air stations, it matches the exact double-layer board shape of the iPhone X, so you separate the board without guessing nozzle angles or overheating nearby components. Steel construction handles repeated heat cycles on your bench. If you deal with iPhone X dead phone, board separation, or IC change jobs regularly, this nozzle removes the trial-and-error that generic round nozzles bring to the job.
