The Relife RL-004FB is a high-temperature silicone repair pad built for iPhone X to 14 Pro Max motherboard-level work. Its dot matrix surface with fixed positioning slots holds small components steady during BGA reballing, camera module repair, Face ID sensor work, fingerprint flex handling, and CPU IC chip soldering. The silicone resists heat up to 500°C without swelling or deforming, so you can run a hot air station or soldering iron directly over it without damaging the surface. It stays flame retardant, corrosion resistant, and fully insulating, protecting your bench and your components from static and heat damage. The pad bends freely and self-resets flat, so it holds its shape through repeated daily use on a busy repair bench.
